r&d @ ifca

Jornadas Futuros Aceleradores, Ciemat Dec 2nd ‘09

R&D @ IFCA

Iván Vila Álvarez Instituto de Física de Cantabria

R&D at IFCA in a nutshell(1) - Players

Physicists: Celso Martínez, Alberto Ruíz, Marcos Fernández, Amparo L. Virto & Iván Vila.

Students: Jordi Duarte, Francisca Muñoz. Engineer: David Moya (mechanics),

Richard Jaramillo (electronics) and J. Gonzalez (software).

2Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila

R&D at IFCA in a Nutshell(2) Technology Network


uStrips Sensors

Transparent Sensors

Double Metal LayerThin Sensors5th GICSERV

CNMSensors

3th, 4th GICSERV

HPKSensors

ALIVABA

FOS Sensors

FOS in CFC

FOS for EMC DCS

FOS in Silicon

Geometry optimization:Simulation

R&D at IFCA in a Nutshell (&3) - Targets

Technology Driven project



Outline: R&D lines

R&D on sensors Improved IR-semitransparent sensors. Thinned micro-strips sensors with integrated pitch

adaptors and embedded FOS. R&D on mechanics

Integration of Fiber Optic Sensors on Silicon and CF composites

Outlook


RD on Sensors: IRuS for alignment

Statement of the issue: Real time position monitoring of the tracker during

detector operation with a few microns accuracy. Reference laser lines going through tracker’s sensors. Name of the game, increase the IR transmittance of

the microstrip sensors introducing minimal modifications to the sensor layout: same materials, avoid fine tuning.

R&D targets: ILD FTD, SiD tracker, CMS tracker upgrade,

AIDA


RD on Sensors: IRuS for alignment (2)

1st Validation of optical simulation software. (done) 2nd Babysensor baseline design (p on n; AC coupling,

50 um pitch) minimal design modifications to boost sensor IR transmittance. (done)

3th Production of IR mini-sensors. (done) 4th Bench testing of sensors (components ready ) 5th Sensors irradiation (optical effects) and beam

testing (SNR) 6th Know-how transfer to main vendors.

Optical computation validation:


Incidence plane1. Validation of optical

simulation software with material samples (planar multilayer samples) Optain optical parameters

2. Validation of optical simulation for layered diffraction grating.

3. Optical simulation of optical test structures and actual sensors.

Difference calibrated-fitted thickness= 2 nm

• Simulation predicts calibrated thickness of 6 calibrated bands of SiO2 [d=0-500] nm on a 1-sided polished Si wafer,

from Ocean Optics

• Si characterized from 1st band (not shown)

Difference calibrated-fitted

thickness= 1 nm !!

CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 9

Validation optical simulation: Materials


CNM wafer + diffraction Al pattern, using GICSERV07 access.

40 diffraction orders45 nm Al roughness

CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 12

Validation Optical Simulation: diffraction pattern


IR transparent mini-sensors Final-Design

OPTICAL TEST STRUCTURES


SiO2 P1 948.0 nmSiO2 GO 49.5 nmP+ / Si / n+ 295 µm

SiO2 P1 996.8 nm

SiO2 P1 929.4 nmSiO2 FO 1002.7 nm

Si / n+ 295 µmSiO2 P1 980.5 nm

SiO2 P1 928.4 nmSiO2 FO 1002.7 nm

Si / n+ 295 µmSiO2 P1 982.5 nm

SiO2 P1 949.9 nmSiO2 FO 1002.7 nm

Si / n+ 295 µmSiO2 P1 1003.4 nm

OTS1 OTS2

OTS3 OTS4

• Test structures simulated(no fit involved)

• n+ and p+ taken optically identical to Si

%T meas%T sim

%R meas%R sim

Sensor measurement vs. calculations.


Final outcome projection

After last pasivation layerTmax > 60% (7 layers)

Compare with 25% @ CMS


Absolute accuracy Determination Direct comparison with interferometric

measurement (accuracy better than 1 um).

4th EUDET Annual Meeting, U. Geneve, 20th October '09, I. Vila

Interferometer reflector

Sensor to be calibrated

Wollaston prism

Laser Paths

Reference granite bench

Preliminary result with CMS ASPD Sensor

Precision below one micron, accuracy < 1.5 um


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almy idaalmy vueltainterferometro idainterferometro vuelta

MIC

RON

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Steps (30 mm)

SiTRA Alignment – HPK Alignment sensors.


•Two single –sensor modules R/O with APV25 Chips (512ch )

•NIR Transmitance ~ 15-25%

SiTRA Alignment – SPS Test beam


AIM: Assessment of SNR for backside removed metallization.

Comparison between track-based and laser alignment.

Testbeam at CERNs SPS(19. to 26. August 2009)

• CERN SPS North Area: H6B• We used the EUDET Beam Telescope

to get triggers and tracksResults• About beam 100Kevents + laser

100Kevents.• Analysis still in progress

Preliminary TB results

SNR sensor scanning comparing Back side with Al vs. n Back side with Al metallization


Alignmentpassage

Particle BeamScanning points

R&D on sensors: Thinned ustrips

GICSERV09 access on ustrip thin sensors.

Direct wafer bonding and deep anisotropic etching.

Aim: frame layout design, FEA analysis, mechanical characterization of dummies, bonding tests, bench & test beam testing.


Figure 2: Thinning of double-sided processed detectors. See text and ref. [6] for further details.

Integrated sensor and chip interconnects

213th Int. Workshop ,8th October '09, I. Vila

Second metal layer for routing and adapting the pitch.

Different geometries are tested. Run to be launch in January

Silicon Optical sensors Reloaded

GAPD optical optimization ?



R&D on mechanics: Bragg grating

Fiber Bragg Grating optical transducer very common to measure strain and temperature

R&D on mechanics: Bragg grating


Basic system


Large Bandwidth

Light source

Optical Spectrum Analyzer

B1

B2 B3

Bn

1x2 coupler

The number of different Braggs The number of different Braggs is more than 100; moreover by is more than 100; moreover by using an optical switching we using an optical switching we can use tents of sensing fiber can use tents of sensing fiber

OFS & FBG advantages


Current R&D activities (OCT’ 09) MECHANICAL DUMMIES & multi-groove wafer structures. Exp. validation of FEA simulations. Conventional KOH anisotropic etching on SOI wafer.


Current R&D activities and plans

Preparation of experimental test stand (profilometer + miniclimate chamber and tensile test machine): Fiber embedding quantitative evaluation. Validation of FE simulation and extraction of

mechanical parameter for thin layers. Equipment (profilometer) delivered this week. Thermal test of instrumented dummies to be

completed at IFIC


OFS work plan – Integration on CF

Integration on CF composite part of CMS R&D Currently working collaboration agreement with

Spanish Aerospace Agency (INTA) for a two year period.

The preliminary plan includes: Complete the market survey. Proposal of fiber routing for CMS upgraded tracker Testing of standalone fibers (irradiation). CF test structures with bonded or embedded fibers. Mechanical expansion and compression test under several thermal

and humidity conditions. Experimental validation of OFS vs. electrical expansion gauges. Comparison with FEA simulations



Integrating OFS & carbon fiber composites

For the Track structure would be interesting to use a embedded fiber optic sensor.

more precise and reliable data It could be use 2 side solution

Better understanding of the results

Useful to quantify the thermal strain

What about DEPFETS?

During the thinning process V-groove could be also etched.


Integration on other Vertex supporting structures very doable

Summary

OFS is a proven technology suitable for building a very fast deformation and temperature monitorZero impact on the system material and heat dissipation, and 100% EMCOther monitoring quantities are in the technology scope: humidity, B field, CO2Initial R&D embedding fibers on Silicon.Preparing R&D on fiber embedding on FC.


Plans

R&D Targets: ILD, SiD, SCMS, SBelle Current activities:

Market survey and contact with OFS vendors Contacting CF producers (Inta, Fermilab,…)

Next activities: Testing of standalone OFS. Prepare CFRP test samples with embedded OPS Preparing some CF test structures with bonded or embedded

fibers. Mechanical and thermal characterization of the test structures.


Short-term Outlook

In 2010: The IR alignment sensor fully tested with laser

and source test bench using ALIVABA electronics.

Irradiation and test beam of IR sensors Thin, integrated pitch adaptors sensors tested

at test bench with APV25 OFS proof of principle for tracking and pixel

structural and environmental monitoring. Other sensing technologies.


GRACIAS


r&d @ ifca

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